Silicon–Organic and Plasmonic–Organic Hybrid Photonics

Chip-scale integration of electronics and photonics is recognized as important to the future of information technology, as is the exploitation of the best properties of electronics, photonics, and plasmonics to achieve this objective. However, significant challenges exist including matching the size...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:ACS photonics 2017-07, Vol.4 (7), p.1576-1590
Hauptverfasser: Heni, Wolfgang, Kutuvantavida, Yasar, Haffner, Christian, Zwickel, Heiner, Kieninger, Clemens, Wolf, Stefan, Lauermann, Matthias, Fedoryshyn, Yuriy, Tillack, Andreas F, Johnson, Lewis E, Elder, Delwin L, Robinson, Bruce H, Freude, Wolfgang, Koos, Christian, Leuthold, Juerg, Dalton, Larry R
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Chip-scale integration of electronics and photonics is recognized as important to the future of information technology, as is the exploitation of the best properties of electronics, photonics, and plasmonics to achieve this objective. However, significant challenges exist including matching the sizes of electronic and photonic circuits; achieving low-loss transition between electronics, photonics, and plasmonics; and developing and integrating new materials. This review focuses on a hybrid material approach illustrating the importance of both chemical and engineering concepts. Silicon–organic hybrid (SOH) and plasmonic–organic hybrid (POH) technologies have permitted dramatic improvements in electro-optic (EO) performance relevant to both digital and analog signal processing. For example, the voltage–length product of devices has been reduced to less than 40 Vμm, facilitating device footprints of
ISSN:2330-4022
2330-4022
DOI:10.1021/acsphotonics.7b00224