Robust Perovskite X‑ray Flat Panel Detector by Anisotropic Conductive Adhesive to Regulate Thermal Stress

Polycrystalline perovskite films offer promise for next-generation X-ray flat-panel detectors due to their ease of large-area fabrication. However, the perovskite–thin-film transistor (TFT) manufacturing mismatch causes defects (e.g., pores, fracture, and delamination), impacting device yield and dead pixel rates. We identify that thermal stress between the perovskite film and TFT array plays a pivotal role in causing these defects. We first propose the strategy of adding an anisotropic conductive adhesive as a stress buffer layer at the original interface. The Tresca stress at the interface was reduced from 113 to 58 MPa. The film fracture, pinhole, and delamination have been suppressed, and the device could even sustain a long-term vibration fatigue test. The assembled FPD exhibits 0.52 lp/pix spatial resolution and a 0.63% dead pixel rate, which outperform previous studies. This approach provides new insights and avenues for the fabrication of integrated perovskite–TFT devices with enhanced interface connectivity.