Low-Temperature Solution-Processed Cu 2 AgBiI 6 Films for High Performance Photovoltaics and Photodetectors

Recently, Cu AgBiI semiconductor has been investigated due to the high absorption coefficient, direct bandgap, and low exciton binding energy, which are promising for eco-friendly photoelectric devices. Herein, pyridine is introduced as solvent additive to completely dissolve the solutes and form cl...

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Veröffentlicht in:ACS applied materials & interfaces 2022-04, Vol.14 (16), p.18498-18505
Hauptverfasser: Zhang, Feijuan, Hu, Zhaosheng, Zhang, Boyao, Lin, Zhenhua, Zhang, Jincheng, Chang, Jingjing, Hao, Yue
Format: Artikel
Sprache:eng
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Zusammenfassung:Recently, Cu AgBiI semiconductor has been investigated due to the high absorption coefficient, direct bandgap, and low exciton binding energy, which are promising for eco-friendly photoelectric devices. Herein, pyridine is introduced as solvent additive to completely dissolve the solutes and form clear Cu AgBiI precursor solution, which results in high-quality films and may provide a general approach for high-quality film growth of other bismuth-based metal halide semiconductors. In addition, the electronic structure of Cu AgBiI has been demonstrated for the first time and shows an intrinsically weak n-type semiconductor. Furthermore, phenethylammonium iodide for surface passivation significantly improves the film quality, slightly n-dopes the material, and shifts up the band level. Finally, the photovoltaics and photodetector performance for n-i-p planar heterojunction devices have been investigated. The efficiency is up to 1%, highest for Cu AgBiI solar cells and comparable with other lead-free bismuth based metal halide solar cells. Moreover, photodetectors with fast speed of rising and decaying time, especially the excellent specific photodetectivity of ∼10 Jones within the wavelength of ∼350-600 nm, are achieved, which paves an alternative and promising strategy for the design of future commercial photodetectors that are self-powered, stable, nontoxic, etc.
ISSN:1944-8244
1944-8252
DOI:10.1021/acsami.2c01481