Kinetics of Methyl Methacrylate Polymerization in the Presence of Initiating Systems “Peroxide + Zirconocene Dichloride” When the Methyl Methacrylate Adhesive is Cured

A kinetic model of the curing of methyl methacrylate adhesive (including nanocomposite methyl methacrylate adhesive) in the presence of the initiating systems “aryl peroxide + zirconocene dichloride” and “aryl hydroperoxide + zirconocene dichloride” is made. Computational experiments have been carried out which demonstrate the relationship of the curing rate with the curing temperature in the range of 323–343 K and with the ratio of the initial concentration of zirconocene dichloride to the initial concentration of the initiator [Mc]0/[I]0 for the following initiators: benzoyl peroxide (PB), ethylbenzene hydroperoxide (HPEB), and ethylbenzene hydroperoxide adduct with cadmium 2-ethyl hexanoate [HPEB·Cd­(EH)2]. It is shown that in order to increase the curing rate of the adhesive, curing should be carried out at a higher temperature (343 K) and at a higher value of the ratio [Mc]0/[I]0 = 10 in the presence of the most rapidly decomposing initiator HPEB·Cd­(EH)2. To increase the weight-average molecular weight of poly­(methyl methacrylate), the proportion of syndiotactic triads in its composition, and consequently, to improve the adhesion strength and heat resistance of the adhesive joint, the curing of the adhesive must be carried out at the reduced temperature (323 K) and the reduced ratio of the [Mc]0/[I]0 = 0.1 in the presence of the least rapidly decomposing initiator HPEB.