Interface diffusion and mechanical properties of ODS-W/Cu prepared by spark plasma sintering

In the absence of an intermediate layer, ODS-W (W–2%Y2O3) and copper (Cu) powders were successfully combined by spark plasma sintering (SPS) in the temperature range of 850 °C-980 °C. In this paper, the microstructure of the joints at different temperatures was investigated by SEM, EDS, and TEM, and the phase composition of the bonded joints was studied by XRD. The effects of sintering temperature on diffusion distance and physical mechanical properties were analyzed. The diffusion distances of Cu and W increased as the bonding temperature increased. At 980 °C, no microcracks and pores were formed at the joint of ODS-W/Cu, and the mutual diffusion distance between W and Cu was the longest, reaching 1.3 μm. When yttrium oxide started to emerge near the ODS-W/Cu joint, the diffusion distance between W and Cu increased. In addition, at 980 °C, the ODS-W/Cu connector has a great difference compared with other temperatures, with the tensile strength up to 312 MPa and hardness up to 200 H V. •Diffusion bonding was achieved between ODS-W and Cu without interlayers by SPS. &gt.•Mutual diffusion occurs between ODS-W and Cu, and the diffusion layer is about 1.3 μm &gt.•Y2O3 particles promotes the interdiffusion between W and Cu. &gt.•The ODS-W/Cu joint exhibits excellent mechanical properties.