Plasma-assisted deposition of indium tin oxide thin films by sublimation using an anodic vacuum arc discharge

•Thin indium tin oxide (ITO) films were deposited using an anodic vacuum arc.•The vacuum arc burns between a hot hollow cathode and a sublimating ITO anode.•ITO deposition rates of about 15 nm/s were achieved with an arc current of 60 a.•Depending on temperature and pressure, crystalline and amorpho...

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Veröffentlicht in:Thin solid films 2021-08, Vol.731, p.138731, Article 138731
Hauptverfasser: Scheffel, Bert, Zywitzki, Olaf, Preußner, Thomas, Kopte, Torsten
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Sprache:eng
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Zusammenfassung:•Thin indium tin oxide (ITO) films were deposited using an anodic vacuum arc.•The vacuum arc burns between a hot hollow cathode and a sublimating ITO anode.•ITO deposition rates of about 15 nm/s were achieved with an arc current of 60 a.•Depending on temperature and pressure, crystalline and amorphous phases are formed.•The roughness of layers deposited at a temperature up to 130 °C is remarkable low. With the anodic vacuum arc discharge as a method of physical vapor deposition (PVD) excellent properties of thin transparent conductive oxide films can be achieved, but the relations between the process parameters and the coating properties have been insufficiently described in the literature. This paper is intended to narrow this gap by investigations on indium tin oxide (ITO) thin films deposited on borosilicate glass sheets by sublimation of indium tin oxide (90:10) using an anodic vacuum arc. The arc discharge is based on a hot hollow cathode electron source and a special evaporator connected as anode. The concentration of the discharge onto the sublimating material is achieved by combining the magnetic fields of an axially symmetrical permanent magnet system and a solenoid coil. Coating rates of about 15 nm/s were achieved with an arc current of 60 A. Measurements with a planar Langmuir probe have shown that the vapor is highly ionized (about 95%). The discharge voltages are relatively low (< 60 V), so it can be assumed that the particle energies are correspondingly low. Substrate temperature (30–300 °C), oxygen gas flow (0–100 sccm) and gas pressure (0.04–0.4 Pa) were varied to study their influence on the thin film properties. Specific electrical conductivity, density and mobility of charge carriers, as well as optical properties were determined and compared with those of other PVD processes. Low specific electrical resistance of 1.8–2.0 x 10–4 Ω cm was reached at a substrate temperature of 200–300 °C independently of the pressure. The mean optical transmission (in the spectral range between 400 nm and 1100 nm) of 100 nm thick ITO films deposited at a temperature of 200 °C and at an optimized oxygen flow was determined to 84%. The roughness of the layers determined by atomic force microscopy is significantly lower than typically for magnetron sputtered films. At a pressure of 0.04 Pa, the crystalline bixbyite phase can already be detected at a coating temperature of approx. 30 °C, whereby the layer growth begins with the formation of an amorphous struc
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2021.138731