Interfacial delamination for an orthotropic thin film/substrate system

In this study, the interface behavior of an orthotropic thin film bonded imperfectly to an orthotropic substrate is considered. The analytical method employs the integro-differential formulation with the aid of membrane assumption. The loading scenarios include either a constant temperature rise applied to the film or a uniform compressive stress applied to the film edges. The sensitivity of the film stresses as well as the shear stress singularity factor to the different material combination are extracted. The results indicate that the shear stress singularity factor dramatically increases as the delamination length exceeds 50% of the film length. The results of this study would be useful for the design engineers focused in flexible and stretchable electronic devices •A theoretical model for an orthotropic film/substrate system is proposed.•The proposed model is effective in analyzing the film delamination from the substrate.•Orthotropic material parameters have a significant effect on the film stresses.•Alumina and E-Glass Epoxy films result in the highest and the lowest stresses.•SSSF is highly sensitive to relative stiffness parameter and the delamination length.