Study on the polishing performance and mechanism of sapphire wafers by different types of degradable surfactants

Traditional chemical-mechanical polishing (CMP) slurry suffers from significant environmental pollution, and easy reaggregation of ultra-fine abrasives, all of which hinder its further application. In this study, the processing performance and mechanism of three different degradable surfactants to sapphire wafers were investigated, utilizing degradable aminomethylpropanol and xylitol as pH regulator and complexing agent of polishing slurry, respectively, which is aimed at solving the problem of the easy agglomeration of ultra-fine abrasives while achieving the super-precision and pollution-free process of sapphire wafers. After polishing, the surface roughness (Sa) of sapphire wafers decreases from 7.240 nm to 0.396 nm, which is 44.8 % lower than that without surfactant. Only