Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure

Synchrotron X-ray analysis of the Sn electromigration behavior and Sn whisker growth in a Blech structure using nano-X-ray fluorescence microscopy and white beam Laue nanodiffraction was conducted. Sn depletion at the cathode and whisker/extrusion formation at the anode were characterized in-situ, a...

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Veröffentlicht in:Scripta materialia 2022-06, Vol.214, p.114682, Article 114682
Hauptverfasser: Lee, Pei-Tzu, Hsieh, Wan-Zhen, Lee, Cheng-Yu, Tseng, Shao-Chin, Tang, Mau-Tsu, Chiang, Ching-Yu, Kao, C.R., Ho, Cheng-En
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Sprache:eng
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Zusammenfassung:Synchrotron X-ray analysis of the Sn electromigration behavior and Sn whisker growth in a Blech structure using nano-X-ray fluorescence microscopy and white beam Laue nanodiffraction was conducted. Sn depletion at the cathode and whisker/extrusion formation at the anode were characterized in-situ, and the results obeyed the electromigration kinetics. This electromigration scenario gradually decayed because of the counterbalance between electron wind force and back stress. White beam Laue nanodiffraction analysis showed that a noticeable compressive deviatoric stress in the direction of electron flow built up at the anode of Sn strips, particularly in the roots of Sn whiskers, confirming that electromigration-induced atomic accumulation occurred downstream in a strip and that Sn whiskering was closely related to internal stress resulting from atomic accumulation in confined segments. Finally, a theoretical model based on fundamental electromigration theory revealed that Sn diffused predominately through lattice and grain boundary paths at Sn homologous temperature of 0.6. [Display omitted]
ISSN:1359-6462
DOI:10.1016/j.scriptamat.2022.114682