Decomposition of SF6 by a plasma focus device

Decomposition of SF6 by a low energy plasma focus (PF) device has been investigated. The PF device performance in SF6 atmosphere was weaker than other gases such as argon, methane and nitrogen. Tungsten and vanadium anode tips were employed to generate thin layers of deposited products on substrates with different number of focused shots in SF6 atmosphere. The proper choice of the anode tip and substrate material has a direct effect on SF6 decomposition and generation of desire products. Free fluorine atoms and ions are produced during discharges that react with housing chamber and corrode the device materials such as Pyrex insulator, 304 stainless steel chamber and many more. Field emission scanning electron microscope (FESEM), energy dispersive X-ray (EDX), grazing incidence X-ray diffraction (GIXRD) and X-ray photoelectron spectroscopy (XPS) were utilized to identify the deposited solid film products. •Reduction of SF6 to solid fluorine and sulfur products.•Reduction of Al2O3 to aluminum metal during SF6 decomposition.•Stability of HxV2O5 and reduction of V2O3 during plasma processing in SF6 atmosphere.•Effect of anode tip and substrate material on the synthesis of solid products during SF6 decomposition.•Corrosion of components of plasma focus device by free fluorine atoms and ions.