Wafer chamfering grinding wheels dressing via dynamic deflection laser beam

•The difficulties in the static laser dressing process of WCF was analyzed and a dynamic deflection method was proposed to solve it.•The block effect and slope effect on material removal was analyzed and a trajectory planning method for dressing small V-shaped grooves was proposed based on the two effects.•The results based on parameter experiments and validation experiments show that the dynamic deflection laser method has a significant improvement in shape accuracy.•The dressing experiment shows that there are fewer deteriorated layers on the surface of the grinding wheel, and there are no obvious defects such as cracks. Wafer chamfering forming grinding wheels (WCF) is a kind of V-shaped circular groove forming wheel with a large diameter and small grooves. In this study, a dynamic deflection laser beam method is presented to improve the dressing quality of WCF. The compensation effect of deflected laser on the surface laser energy density of materials was analyzed, and the blocking effect caused by oversized deflection angle of laser beam was analyzed. A C-W model was proposed for laser dressing of WCF. Based on C-W model, trajectory planning for laser dressing was carried out, and dressing experiments were completed. The results show that the contour transition of the grinding wheel is more smooth. Compared to single direct laser beam dressing method and static deflection laser dressing method, the contour exhibits better roundness and the PV values reduced to 5.1μm. Surface observation revealed strip-shaped patterns and some flocculent metamorphic layer. The SEM result shows that there are no obvious crack defects on the surface.