Influence of void damage on the electromechanical impedance spectra of Single Lap Joints

Adhesively bonded joints are susceptible to a variety of damage sources, which may be of difficult detection with current Non-Destructive Testing (NDT) methods. Structural Health Monitoring (SHM) techniques, such as the Electromechanical Impedance Spectroscopy (EMIS), aims to outpace NDT by continuously monitoring structures for defects. However, given the complexity of adhesive joint structures, EMIS capability for damage detection still needs to be thoroughly studied. In this manner, electrical impedance measurements were done to Single Lap Joints (SLJ), with both a modified epoxy adhesive and Pressure Sensitive Adhesive (PSA) for void detection. Void defects could not be detected on adhesive joints with the PSA but, in the case of joints with the modified epoxy adhesive, impedance signatures were significantly altered by the presence of both the artificially created void, and by a second damage source caused during the SLJ manufacture. Experimental measurements from modified epoxy joints were compared with simulation results, yielding good approximation when considering the effect of the second source of damage. An approximation of the mechanical impedance was also computed using numerical results from the pristine SLJ model. In this manner, it is possible to detect damage in the adhesive layer of SLJs with electrical impedance measurements from EMIS. •Verification of the capability of EMIS to detect voids in structural adhesive joints.•Influence of boundary conditions on the electrical impedance measurements verified.•Finite element validation of the capability of EMIS in detecting voids.•Correlation between electrical and approximated mechanical impedances of the joint.