Effect of Mo addition on microstructure and mechanical properties of Cu-12.5Ni-5Sn alloy

Cu-12.5Ni-5Sn-xMo (x=0, 0.5, 1.0, 1.5 wt%) alloys were prepared using Spark Plasma Sintering (SPS) technology. The effect of Mo addition on the microstructure and mechanical properties of Cu-12.5Ni-5Sn alloy was investigated. The results indicate that adding trace amounts of Mo significantly refines...

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Veröffentlicht in:Materials today communications 2024-12, Vol.41, p.110407, Article 110407
Hauptverfasser: Liu, Jingde, Li, Zhen, Yang, Guirong, Liu, Xiaoxiong, Du, Xugong, Shi, Wei, Yang, Shixia
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Sprache:eng
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Zusammenfassung:Cu-12.5Ni-5Sn-xMo (x=0, 0.5, 1.0, 1.5 wt%) alloys were prepared using Spark Plasma Sintering (SPS) technology. The effect of Mo addition on the microstructure and mechanical properties of Cu-12.5Ni-5Sn alloy was investigated. The results indicate that adding trace amounts of Mo significantly refines the grain structure of Cu-12.5Ni-5Sn alloy, attributed to the formation of Mo-rich phases. Mo addition also inhibited the growth of discontinuous precipitation (DP) after aging treatment, reducing the DP volume fraction from approximately 25 % to 6 %. This effect is attributed to the precipitation of micron-sized Mo-rich phases at grain boundaries, which inhibit DP nucleation and growth by occupying γ-phase nucleation sites and pinning grain boundaries, thus impeding grain boundary diffusion. In addition, the interlamellar spacing of the discontinuous precipitation increases and the growth rate of lamellae decreases with increasing Mo content. Furthermore, an optimized combination of hardness (310 HB) and yield strength (586 MPa) was achieved in the Cu-12.5Ni-5Sn-1.0Mo alloy after aging treatment. [Display omitted] •When the addition of Mo is 1.0 wt%, its existence is Mo-rich phase.•The DP volume fraction of the alloy was reduced from 25 % to 6 %.•The relative density of CNS1.0Mo alloy prepared by SPS reached 100.01 %.•The aging peaks of hardness and yield strength are about 310 HB and 586 MPa.
ISSN:2352-4928
2352-4928
DOI:10.1016/j.mtcomm.2024.110407