Modulation of flexibility and shape recovery of living Schizophyllum commune pure mycelium material by hydration
Pure mycelium materials (PMMs) are novel sustainable materials that could for instance be used as a foam, cellular scaffold, or as an alternative for textile, leather, or meat. Here, mechanical properties of the PMM of the fungus Schizophyllum commune were studied when exposed to different levels of...
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Veröffentlicht in: | Materials today communications 2024-08, Vol.40, p.109784, Article 109784 |
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Sprache: | eng |
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Zusammenfassung: | Pure mycelium materials (PMMs) are novel sustainable materials that could for instance be used as a foam, cellular scaffold, or as an alternative for textile, leather, or meat. Here, mechanical properties of the PMM of the fungus Schizophyllum commune were studied when exposed to different levels of relative humidity (RH) and after submersion in water. Exposure to increasing RH resulted in a more flexible PMM. For instance, exposure to 95 % RH decreased the Young’s modulus from 467 to 3.7 MPa and increased elongation at break from 1 % to 18.5 %. Similar properties were found after submersion in water, enabling reshaping the PMM in a mould. Notably, the PMM showed shape memory when it was exposed to cycles of drying in a 90° angled shape, wetting, drying at 180°, and submersion in water. The material reached a mean percentage of shape recovery completeness of 49 %, 55 %, and 66 % in the first, second and third cycle, respectively. The capacity to store and release potential energy was not affected during these cycles. Together, a living PMM with hygromorphic shape memory is described for the first time, which may be used for instance in smart switches or valves.
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•Exposure to increasing RH results in a more flexible pure mycelium material.•Exposure to high RH or water enables reshaping of the pure mycelium material.•A living pure mycelium material with hygromorphic shape memory is described.•Storage and release of potential energy is not affected during shape memory cycles.•The shape memory material reaches a percentage of completeness of 49–66 %. |
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ISSN: | 2352-4928 2352-4928 |
DOI: | 10.1016/j.mtcomm.2024.109784 |