Spatial 3D correlation of flux pinning with porosity distribution in YBa2Cu3O7−δ using tensorial neutron tomography

Engineering devices from High Temperature Superconductors (HTS) for practical applications such as in transport and medical imaging requires an understanding of their critical current density (JC) distribution and how the material properties affect this. JC describes the maximum gradient of flux tha...

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Veröffentlicht in:Materials today communications 2024-06, Vol.39, p.108579, Article 108579
Hauptverfasser: Oji, U.K., Hilger, A., Manke, I., Foerster, C., Cubitt, R., Kardjilov, N.
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Sprache:eng
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Zusammenfassung:Engineering devices from High Temperature Superconductors (HTS) for practical applications such as in transport and medical imaging requires an understanding of their critical current density (JC) distribution and how the material properties affect this. JC describes the maximum gradient of flux that can be found in a superconductor sustained by vortex pinning which is the preferential positioning of vortex in defective regions of weaker superconductivity. Local correlation of imperfections with high pinning has required destructive methods such as slicing then scanning with local magnetic probes. We describe the first case of non-destructive spatial correlation of flux pinning and consequently JC with bulk imperfections at different temperatures in top-seeded melt grown (TSMG) YBa2Cu3O7−δ chosen for its high pinning in addition to a rich structure of pores, twins and grain boundaries. This is facilitated by a combination of polarized neutron tomography to image trapped magnetic fields in a range around the material critical temperature and conventional neutron tomography to characterize potential pinning objects. The results indicate that there is indeed preferential trapping in the porous regions independent of the resolvable pore size. Polarized optical microscopy data suggests that the observed phenomenon is attributable to twin boundaries and crack defects located at the pore interface. [Display omitted]
ISSN:2352-4928
2352-4928
DOI:10.1016/j.mtcomm.2024.108579