Nickel-zinc tungstate nanocomposites deposited on copper surface for corrosion protection in chloride solution

Eco-friendly protective coating of oxide film was successfully grown on copper surface by nickel-zinc tungstate and DNA (NZW-DNA). DNA chain-like structure was architectural in the growth mechanism of the oxide film. The fabricated protective film displayed a tremendous improvement in the resistance of Cu in aggressive chloride medium. [Display omitted] •Co-precipitation of nickel-zinc tungstate (NiWO4-ZnWO4), in the presence and absence of DNA, was carried out.•A combination of DNA and NPs increased film adsorption and adherence with a synergistic corrosion inhibition.•Film coverage and DNA network were enriched with Ni and W for corrosion resistance.•Electrochemical investigations showed an enhanced corrosion protection of copper. Several methods such as drop-casting, electrophoretic and chemical vapour depositions have shown the successful deposition of nanomaterials such as graphene oxide, cerium oxide, etc. on metals for various applications such as energy storage, and corrosion protection due to their large surface area and barrier formation. However, these films despite their strong barrier property have been less effective in the area of corrosion protection due to porosity and poor adherence. Here we describe an environmentally benign nickel-zinc tungstate (NiWO4-ZnWO4) nanocomposite with great adhesion and reduced porosity due to improved adsorption sites and film ordering inspired by deoxyribonucleic acid (DNA). The synthesis of the newly designed mixed-metal oxide was done via a simple wet-chemical process in the presence of DNA and in-absence of DNA. Electrochemical analyses confirmed improved corrosion protection of Cu by approximately two orders of magnitude by using nickel-zinc tungstate with DNA compared to only the sample without DNA and the blank system (without any inhibitor).