Effect of nano silicon nitride integration on the curing performance of DGEBA epoxy matrix at ambient temperature

•Nanofiller assisted curing of epoxy at ambient temperature is investigated.•Uniform dispersion of nanofiller as observed from HR-TEM images encourages thermal stress transfer.•The interface thickness of ∼1.16 nm obtained from Lipatov’s theory can be assigned to efficient curing.•Higher activation energy and char yield for the nanocomposite with respect to neat epoxy suggests high crosslink density. Epoxy curing requires substantial thermal energy input and is constrained by the specimen’s scale, shape, and design, especially with autoclave processing. This challenge is addressed in the present study by incorporating Silicon Nitride (SiN) nanoparticles into an epoxy matrix to enhance curing efficiency at room temperature. High-resolution transmission electron microscopy (HR-TEM) demonstrated a uniform dispersion of nanofillers within the epoxy, indicating improved mechanical and thermal stress transfer between the matrix and the filler. The interphase thickness, determined to be 1.16 nm using Lipatov’s theory and differential scanning calorimetry (DSC) thermograms, suggests excellent matrix-filler interaction and a significant increase in cross-link density. Thermogravimetric analysis (TGA) revealed an increase in activation energy by 63 %, 101 %, and 113 % at heating rates of 10, 20, and 30 °C/min, respectively, indicating enhanced thermal stability of the nanocomposite. Additionally, the char yield increased by 7 %, 18 %, and 22 % at the same heating rates, signifying the formation of effective crosslinks, leading to a higher proportion of solid remnants rather than volatiles during degradation.