Improved mechanical properties and thermal conductivity of laser powder bed fused tungsten by using hot isostatic pressing
•The HIP followed by ultra-rapid quenching (URQ) was employed to the LPBFed W parts.•The UCS of the HIP-URQ sample was enhanced to 1180 MPa without sacrificing hardness.•The highest thermal conductivity reported of the LPBFed W was achieved after HIP. In this study, the microstructure evolution, mec...
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Veröffentlicht in: | Materials letters 2024-12, Vol.377, p.137335, Article 137335 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | •The HIP followed by ultra-rapid quenching (URQ) was employed to the LPBFed W parts.•The UCS of the HIP-URQ sample was enhanced to 1180 MPa without sacrificing hardness.•The highest thermal conductivity reported of the LPBFed W was achieved after HIP.
In this study, the microstructure evolution, mechanical properties and thermal conductivity of laser powder bed fused tungsten subjected to the subsequent hot isostatic pressing (HIP) processes with natural cooling (NC) and ultra-rapid quenching (URQ) were investigated. The results showed that the relative density was significantly improved after HIPping regardless of the cooling rates. The HIP-URQ treatment led to a near defect-free component with increased recrystallization and reduced dislocation density. The enhanced comprehensive mechanical properties, including the ultimate compressive strength of 1180 MPa without sacrificing microhardness was achieved for the HIP-URQ sample. Furthermore, the highest thermal conductivity of 168.6 W/(m·K) related to the densification behaviour and microstructure evolution during the HIP treatments was reported. |
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ISSN: | 0167-577X |
DOI: | 10.1016/j.matlet.2024.137335 |