Ultra-low-temperature lead-free multicomponent alloy solder for application in heat-sensitive electronic components

•Ultra-low-temperature solder for heat-sensitive electronic devices.•The alloy comprises Sn, Bi, In, Cu, and Zn in proportions (SnBiIn)80(CuZn)20.•The DSC analysis shows a melting point of 83.7 °C.•Average IMC thickness and θ° range are between 3 and 6 µm and 47.5–52.5°.•Shear stress/strain presents values between 10 and 14 MPa and 0.40–0.65 mm/mm. This manuscript describes the development of a lead-free multicomponent solder alloy composed of Sn, Bi, In, Cu, and Zn for heat-sensitive electronic devices. The microstructure comprises a homogeneous distribution of CuZn particles embedded in a eutectic mixture of Sn (solid solution) and InBi with a melting temperature of 83.7 °C. The average thickness of the generated intermetallic compounds between solder/substrate (Cu) was