Flavor encapsulation into chitosan-oleic acid complex particles and its controlled release characteristics during heating processes

Encapsulation of a highly volatile, hydrophobic flavor compound, l-limonene (LIM), and its release behavior during simulated cooking experiments under various heating conditions were investigated using chitosan-oleic acid (CHI-OA) complex particles as a colloidal carrier for flavor encapsulation. An aqueous solution of CHI and ethanolic solution of OA containing LIM were mixed, and the complex particles with homogeneous diameter distribution with a mean diameter of ∼1 μm were formed in a self-assembly manner. The flavor release behavior under different heating conditions using conventional or microwave heating devices was analyzed via the Avrami equation. The results revealed that the flavor release rate from the CHI-OA complex particles was significantly affected by temperature and heating methods, indicating that the release behavior of the encapsulated flavor was tunable by controlling the heating conditions. The complex particle suspension containing flavor molecules could be autoclaved and spray-dried while retaining their colloidal dispersibility and controlled release ability. •A novel colloidal carrier material for flavor encapsulation has been developed.•Chitosan-oleic acid complex particles can be used for encapsulating l-limonene.•The limonene-encapsulating particle dispersion is autoclavable.•Flavor release rate can be controlled by conventional and microwave heating.•Powderization by spray-drying and re-dispersion in water were successfully achieved.