Dopant-grading proposal for polysilicon passivating contact in crystalline silicon solar cells

Polycrystalline silicon/crystalline silicon (poly-Si/c-Si) passivating contacts are an attractive option for improving the efficiency of c-Si-based solar cells. The heavy doping required for a poly-Si layer to ensure high-quality passivation of the contact can cause substantial dopant diffusion into...

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Veröffentlicht in:Journal of power sources 2022-02, Vol.522, p.231005, Article 231005
Hauptverfasser: Pham, Duy Phong, Yi, Junsin
Format: Artikel
Sprache:eng
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Zusammenfassung:Polycrystalline silicon/crystalline silicon (poly-Si/c-Si) passivating contacts are an attractive option for improving the efficiency of c-Si-based solar cells. The heavy doping required for a poly-Si layer to ensure high-quality passivation of the contact can cause substantial dopant diffusion into the c-Si during the high thermal annealing process, as well as internal defects; this reduces the passivation quality. We propose a simple dopant grading of the poly-Si layer to suppress dopant diffusion and defects. The grading is implemented by varying the dopant concentration through poly-Si preparation. Accordingly, a high dopant concentration is distributed far from the c-Si interface, whereas a low one is an inverse. The grading improves passivation quality significantly, allowing for a high implied open-circuit voltage (iVoc) of 730 mV and a low recombination current density (Jo) of 5.1 fA/cm2. Owing to the grading, the solar cell devices exhibit enhancements of 10 mV, 0.5%, and 0.6% in the open-circuit voltage, fill factor, and efficiency, respectively. A silicon heterojunction solar cell using a back-side-graded poly-Si layer achieves a conversion efficiency of 22%. The proposed grading technique exhibits considerable potential as a simple and efficient technology for c-Si solar cells. •Doping grading technique for high-quality poly-Si/c-Si passivating contact.•Suppressing c-Si into massive dopant diffusion and defects inside poly-Si.•A simple and efficient technique for high-efficiency device manufacturing.
ISSN:0378-7753
1873-2755
DOI:10.1016/j.jpowsour.2022.231005