Review on three-dimensional ceramic filler networking composites for thermal conductive applications

•Structural engineering of thermally conductive films to improve heat dissipation are discussed.•Properties of different filler-based composites are reviewed.•Trends and issues of development of 3D network structured composites are discussed.•Future research topics associated with the 3D networking composites with ceramic fillers are also suggested. Three-dimensional (3D) ceramic filler networking composites feature isotropic heat dissipation properties owing to the spatial distribution of their fillers, which form continuous thermal conduction paths that ensure a high thermal conductivity. Therefore, this type of filler networking is considered ideal in thermally conductive ceramic-filler-based composites. This review discusses the research advances achieved thus far for improving the heat dissipation properties of thermally conductive ceramic filler networking composites, with a special focus on structural engineering applications. The most popular methods for fabricating composites with 3D filler networking are also examined. Finally, existing issues and future perspectives associated with the use of these composites are considered. [Display omitted]