Microalloying effects on the mechanical and electrical properties of CuCrSnZnSi alloys

The dissolution of CrxSi compounds at the grain boundaries of Cu-0.2 wt%Cr-0.252 wt%Sn-0.166 wt%Zn-0.014 wt%Si alloy into the matrix is more complete after solid solution treatment, but a small amount of CrxSi compounds remains inside the grains. After annealing, Cr is precipitated in the matrix as a nanophase, whereas Sn, Zn, and Si are dispersed in the matrix as solid solutions. Quantitative analysis and characterization of the strengthening mechanism and electrical conductivity of the alloy were conducted herein, and the calculated results were consistent with the experimental results. Grain boundary scattering, Cr nanophase scattering, and solid solution scattering of elemental Si had a relatively small impact on the electrical conductivity of the alloy. Solid solution scattering of the Sn and Zn elements affected the electrical conductivity of the alloy more significantly. In addition, grain boundary strengthening contributes the most to the increase in yield strength, followed by nanophase precipitation strengthening, solid solution strengthening, and dislocation strengthening. The quantitative calculation of microalloying can provide a basis for the composition ratio of alloys with different performance requirements, reduce the number of experiments, improve research and development efficiency, and reduce costs. •Quantitative analysis of the influence of alloying elements on the mechanical and electrical properties of copper alloys.