Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion

Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion

Negative thermal expansion not only challenges the traditional lattice concept, but also provides new opportunities for regulating the thermal expansion coefficient and addressing the increasing reliability demands in power device packaging. In this study, ZrW2O8 nanorods were firstly introduced int...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of alloys and compounds 2024-08, Vol.996, p.174874, Article 174874
Hauptverfasser: Xu, Yuxin, Qiu, Xiaoming, Wang, Suyu, Huo, Fupeng, Su, Yutai, Xu, Long, Ma, Ninshu, Chen, Chuantong, Suganuma, Katsuaki
Format: Artikel
Sprache:eng
Schlagworte:
Ag/ZrW2O8 sintering
Electronic packaging
Negative thermal expansion
Semiconductor devices
Thermal shock
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Negative thermal expansion not only challenges the traditional lattice concept, but also provides new opportunities for regulating the thermal expansion coefficient and addressing the increasing reliability demands in power device packaging. In this study, ZrW2O8 nanorods were firstly introduced into the micron Ag paste via a facile low-temperature (≤300 ℃) low-pressure (
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2024.174874