Planar defects-induced low thermal conductivity in a superhard material SiB6

Planar defects-induced low thermal conductivity in a superhard material SiB6

Generally materials with low thermal conductivity require weaker interatomic bonding, considered as soft materials. Here we demonstrate that SiB6 with planar structural defects shows low thermal conductivity, but uncommonly high strength. Planar defects-induced polycrystalline SiB6 (PD-SiB6) has a r...

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Veröffentlicht in:Journal of alloys and compounds 2023-04, Vol.939, p.168744, Article 168744
Hauptverfasser: Tanusilp, Sora-at, Kumagai, Masaya, Ohishi, Yuji, Ishimaru, Manabu, Sadayori, Naoki, Kurosaki, Ken
Format: Artikel
Sprache:eng
Schlagworte:
High strength material
Planar defects
SiB6
Thermal conductivity
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Zusammenfassung:Generally materials with low thermal conductivity require weaker interatomic bonding, considered as soft materials. Here we demonstrate that SiB6 with planar structural defects shows low thermal conductivity, but uncommonly high strength. Planar defects-induced polycrystalline SiB6 (PD-SiB6) has a relatively large Vickers hardness, which is comparable to those of well-known superhard materials, despite of relatively low thermal conductivity (
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2023.168744