A novel Cu-containing TiZrNb-based medium entropy alloy with excellent mechanical properties, antibacterial activity and biocompatibility
Bacterial infection and stress shielding remain significant challenges in the field of orthopedic implant applications. Therefore, it is imperative to develop novel medical implant materials that possess exceptional mechanical properties, antibacterial efficacy, and biocompatibility. The current stu...
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Veröffentlicht in: | Intermetallics 2024-08, Vol.171, p.108347, Article 108347 |
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Sprache: | eng |
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Zusammenfassung: | Bacterial infection and stress shielding remain significant challenges in the field of orthopedic implant applications. Therefore, it is imperative to develop novel medical implant materials that possess exceptional mechanical properties, antibacterial efficacy, and biocompatibility. The current study reports a novel Ti1.2Zr1.2Nb0.6Cu0.15 medium entropy alloy (MEA) with an optimal combination of mechanical properties, antibacterial activity and biocompatibility. In the Ti1.2Zr1.2Nb0.6Cu0.15 MEA, bits of copper-enriched phases were uniformly dispersed within the body-centered cubic matrix phase. The MEA exhibited good strength-ductility combination with the yield strength of 906 MPa and the fracture elongation of 17.4 %. It is noteworthy that the MEA had a significantly lower elastic modulus (∼67 GPa) compared to pure titanium and Ti6Al4V (∼110 GPa) thus mitigating stress shielding. Meanwhile, the Cu ions released by the alloy resulted in remarkable antibacterial efficacy with an antibacterial rate of 99 % against Escherichia coli. Furthermore, this alloy displayed corrosion resistance and biocompatibility comparable to those of the Ti6Al4V alloy. These findings provide novel insights for designing antibacterial implant materials with excellent comprehensive performance.
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•The TiZrNbCu alloy has good strength-ductility combination and low modulus.•The antibacterial rate of the TiZrNbCu alloy against E. coli exceeds 99 %.•The TiZrNbCu alloy exhibits excellent corrosion resistance and biocompatibility. |
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ISSN: | 0966-9795 1879-0216 |
DOI: | 10.1016/j.intermet.2024.108347 |