Thermal management and structural parameters optimization of MCM-BGA 3D package model

The multi-core technology promotes the efficiency improvement of microelectronic devices. However, the increasing power and heat flux lead to heat dissipation problems on hotspots, which severely affects the performance of electronic devices and impedes the development of electronic techniques. Therefore, thermal management suitable for electronic packaging is crucial. In this paper, a multi-chips module combined with ball grid array (MCM-BGA) 3D package model was established; the thermal interface resistance between the micro-channel heat sink and heat spreader was considered; the flow heat transfer as well as thermal stress performance of the model were discussed. The results indicate that the MCM-BGA 3D package model can maintain the maximum temperature and thermal stress in a satisfactory range. However, the major concentration areas of the maximum temperature are the chips and solder balls, especially the welding spots. Based on the analysis, the multi-parameters optimization of structural parameters was conducted. After the optimization, the maximum temperature and thermal stress decrease by 5 K and 20% in average, respectively. The optimal thickness of thermal interface material, heat spreader and substrate are 0.1 mm, 1.2 mm and 1.2 mm, respectively. •Multi-Chips Module combined with Ball Grid Array 3D package model was established.•Flow heat transfer and thermal stress performance of the model were obtained.•Multi-parameters optimization of structural parameters was conducted.