A novel thermal interface membrane structure based on phase change material for thermal management of electronics

As an important part of the heat dissipation system of electronic devices, thermal interface membranes (TIM) can largely eliminate the interface thermal resistance between electronic devices and heat sinks. However, the minimum thickness of TIM which is constrained by the maximum assembly pressure that the electronic chip can withstand and the marginal cost caused by the continuous improvement of thermal conductivity makes the development of conventional TIM bottlenecked. This paper proposes a novel laminar temperature control structure based on form-stable phase change material with thermal-induced flexibility (TF-FSPCM). When the TF-FSPCM is thin (0.79 cm2K/W and the minimum theoretical thermal resistance is