Based on mussel-inspired modified BN fillers and their application in thermally conductive silica rubber

Nowadays, with electronics becoming more refined and integrated, the heat transfer problem between devices is becoming increasingly problematic, so thermal interface materials with good thermal conductivity are becoming more critical. In this paper, thermally conductive composites are prepared based...

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Veröffentlicht in:Diamond and related materials 2023-04, Vol.134, p.109777, Article 109777
Hauptverfasser: Guo, Youkui, Zhao, Xusheng, Ma, Wenshi
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Sprache:eng
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Zusammenfassung:Nowadays, with electronics becoming more refined and integrated, the heat transfer problem between devices is becoming increasingly problematic, so thermal interface materials with good thermal conductivity are becoming more critical. In this paper, thermally conductive composites are prepared based on silicone rubber (SR), and boron nitride coated with tannic acid and grafted with hexamethyldisilazane (BN@TA-HMDS). After modification with TA-HMDS, BN@TA-HMDS and silicone rubber has excellent compatibility and can be well dispersed within the silicone rubber matrix. It can be found that when the mass part11The mass part means the mass ratio of two substances (one of which is a reference of 100), for example, if A is 5 g and B is 10 g, then the mass part of A is 50. of BN@TA-HMDS is 50, the thermal conductivity of the composites reaches 0.735 W/m·K, which is about 6 times that of pure SR. In addition, the viscosity of the composite before cured is significantly reduced. When the mass part of BN@TA-HMDS is 50, the system's viscosity is only 1/50 of the BN/SR at the same ratio. This work provides a good guideline for the mass filling to build a better thermal pathway to improve the material's thermal conductivity. [Display omitted] •Modification of BN based on mussel inspiration•HMDS as a coupling agent improves the compatibility between BN and SR.•Thermal conductivity and viscosity of the composite are significantly improved.
ISSN:0925-9635
1879-0062
DOI:10.1016/j.diamond.2023.109777