Influence of rapid high-temperature processing on the interface of CF/PEEK, a quick and effective method for enhancing the IFSS

This study explores the effect of rapid high-temperature processing on the interface of carbon fibre (CF) reinforced poly-ether-ether-ketone (PEEK). Specimens that have been thermally treated at slower and faster heating rates and specimens that have not been post-manufacturing treated (virgin) are...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Composites science and technology 2024-05, Vol.251, p.110564, Article 110564
Hauptverfasser: Gaitanelis, Dimitrios, Worrall, Chris, Kazilas, Mihalis
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:This study explores the effect of rapid high-temperature processing on the interface of carbon fibre (CF) reinforced poly-ether-ether-ketone (PEEK). Specimens that have been thermally treated at slower and faster heating rates and specimens that have not been post-manufacturing treated (virgin) are examined with single fibre pull-out tests. A comparison between their interfacial shear strength (IFSS) and their failure modes takes place. Scanning electron microscopy is used to assess the surface morphology of the thermally treated specimens, and partly cross-polarised microscopy is employed to investigate the development of transcrystallinity. Furthermore, to identify the extent of thermal degradation the specimens are examined with attenuated total reflection Fourier transform infrared spectroscopy. At faster heating rates, an improved interfacial adhesion up to 25% is found at temperatures where a low-level thermal damage is induced. At higher temperatures and despite the increased thermal damage, an IFSS increase of up to 10% is still identified. This is due to the beneficial formation of thermal residual stresses upon high-temperature processing, and overall, especially rapid high-temperature processing could effectively serve for enhancing the interface properties of CF/PEEK. [Display omitted] •The CF/PEEK interface is examined in slower and faster high-temperature processing.•High-temperature processing results in thermal residual stresses at CF/PEEK.•At faster heating rates an improved interfacial adhesion up to 25% is found.•At elevated temperatures and despite the increased thermal damage, an improved IFSS of up to 10% is still identified.•Rapid high-temperature processing could serve for enhancing the CF/PEEK interface.
ISSN:0266-3538
1879-1050
DOI:10.1016/j.compscitech.2024.110564