Bayesian optimization-based prediction of the thermal properties from fatigue test IR imaging of composite coupons
The prediction of the prevailing self-heat transfer parameters of a glass/epoxy composite coupon during fatigue testing in general and the distinction between viscoelastic- and frictional crack growth-related energy dissipation in particular, are not trivial problems. This work investigates the feas...
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Veröffentlicht in: | Composites science and technology 2024-03, Vol.248, p.110439, Article 110439 |
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Sprache: | eng |
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Zusammenfassung: | The prediction of the prevailing self-heat transfer parameters of a glass/epoxy composite coupon during fatigue testing in general and the distinction between viscoelastic- and frictional crack growth-related energy dissipation in particular, are not trivial problems. This work investigates the feasibility of predicting the convective film coefficient, the total work loss as well as the ratio between viscoelastic and fracture-induced damping from thermal images using Bayesian optimization in conjunction with 3D FE thermal analysis. To this end, glass fiber/epoxy biax coupons are pre-damaged by means of a drop weight impact machine and subsequently tested under uniaxial tension-tension high cycle fatigue conditions. IR images are taken of the self-heating thermal profile at steady-state conditions. Synthetic surface thermal images are generated by numerical thermal analysis of the damage distribution obtained by μ-CT scanning prior to testing. Bayesian optimization of the aforementioned parameters is conducted by minimizing the loss function between the as-measured and the synthetic IR image. The predicted work-loss is consequently validated against the measured hysteretic response, from which a very good agreement is found.
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•Thermal heat transfer parameters are predicted via Bayesian optimization (BO).•FEM and BO are combined to find physically meaningful parameters.•The method efficiently handles 3D parameters compared to other approaches. |
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ISSN: | 0266-3538 1879-1050 |
DOI: | 10.1016/j.compscitech.2024.110439 |