A simple and versatile photothermal dual-curing system design based on phytophenol derivatives and thiol chemistry for potential electronic encapsulant application

Preparation of photothermal dual-curing networks of three bio-based monomers and their potential application in electronic encapsulant application. [Display omitted] •Three biobased multi-functional monomers that can meet both photo and thermal dual-curing were designed and synthesized.•The study explored the relationship between the structure and properties of the dual-curing multi-functional monomers.•The process, properties and sequence of the designed photo-thermal dual curing system were studied in detail.•This thiol-mediated dual curing system has potential application in the field of electronic encapsulation. Given the diversity of thiol chemistry, researchers are actively exploring its potential as a versatile compound. This paper presents the synthesis of three bio-based multifunctional monomers (EPMG, EPBEG, EPBEF) containing allyl and epoxy groups using phytophenols (magnolol and eugenol) as raw materials. Photothermal dual curing was performed using pentaerythritol tetrakis(3-mercaptopropionate) (PETMP). Comprehensive studies and comparisons of the cured systems were conducted, including curing kinetics, mechanical properties, dielectric properties, and transmittance. The effect of the curing sequence was systematically investigated. The results demonstrate that as the curing proceeds, the mechanical properties and glass transition temperature (Tg) of the material improve significantly, and the dual curing process exhibits excellent bonding, dielectric, and ultraviolet (UV) shielding performance. Moreover, the differences in monomer structure (methoxy, benzene ring connection) also impact the properties of the monomers and the performance of the material. This work provides a novel approach to designing epoxy monomer structures and developing bio-based single-component dual-curing systems. This thiol-mediated dual-curing system has potential applications in electronic materials and personal protective equipment can contribute to achieving miniaturization, precision, and integration in various applications.