Magnetically assembled flexible phase change composites with vertically aligned structures for thermal management and electromagnetic interference shielding

•Multifunctional FMP is developed by dual-encapsulation design of integrating NdFeB@Ag arrays and SEPS networks.•NdFeB@Ag arrays provide oriented highways for heat transfer, and electric/magnetic heterostructure for EMI SE.•SEPS endows PCM with flexibility, and combines with NdFeB@Ag arrays for anti...

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Veröffentlicht in:Chemical engineering journal (Lausanne, Switzerland : 1996) Switzerland : 1996), 2024-09, Vol.495, p.153361, Article 153361
Hauptverfasser: Guo, Hong, Hu, Boyang, Shan, Huiting, Li, Zhen, Qi, Weiyan, Li, Baoan
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Sprache:eng
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Zusammenfassung:•Multifunctional FMP is developed by dual-encapsulation design of integrating NdFeB@Ag arrays and SEPS networks.•NdFeB@Ag arrays provide oriented highways for heat transfer, and electric/magnetic heterostructure for EMI SE.•SEPS endows PCM with flexibility, and combines with NdFeB@Ag arrays for anti-leakage. [Display omitted] Phase change material (PCM) is promising in achieving zero-energy thermal management because of its prominent thermal storage capacity and steady phase-change temperature. However, low intrinsic thermal conductivity (TC), liquid leak, and solid rigidity are long-standing bottlenecks for heat-related applications. Here, we report an innovative dual-encapsulation strategy to develop multifunctional phase change composite (FMP) with vertically aligned NdFeB@Ag arrays and styrene-ethylene-propylene-styrene (SEPS) crosslinked network in paraffin (PA). The NdFeB@Ag arrays induced by magnetic-field driven procedure can offer the consecutive/oriented highways for efficient heat-transfer, and an electric/magnetic heterostructure for electromagnetic interference shielding efficiency (EMI SE). The flexible SEPS block copolymer not only ensures the high flexibility of PCM, but also combines with oriented NdFeB@Ag arrays for dual encapsulating PA. This multifunctional FMP can achieve high TC of 2.59 W m−1 K−1, attractive EMI SE of 35.42 dB, prominent enthalpy density of 120 J g−1, and impressive Joule heating performance, together with leakage-proof, dynamic assembly, and salient charging/discharging durability. Furthermore, the FMP-supported device is demonstrated for thermal energy harvesting and utilization. This dual-encapsulation design opens a new avenue for exploiting multifunctional PCMs for thermal management, anti-EM radiation, and low-grade exhaust heat utilization.
ISSN:1385-8947
DOI:10.1016/j.cej.2024.153361