Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

[Display omitted] •A honokiol-based bioepoxy (DBDBBB) was synthesized via a facile and mild route.•DBDBBB cured by diamine 33DDS/44DDS afforded highly thermal stable epoxy resins.•The resins showed excellent dielectric property, thermal conductivity, and flame retardancy.•A quenching effect favored the enhancement of DMA and thermal-conductive properties, etc. To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (Tmax up to 451 °C), thermal conductivity (~0.743 W/m•K), and high specific heat (5.364 J/g•K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 °C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.