High-efficiency electromagnetic interference shielding and thermal management of high-graphene nanoplate-loaded composites enabled by polymer-infiltrated technique

Polymer composites embedded with high filler loads (≥50 wt%) are urgently needed to address the electromagnetic interference (EMI) shielding and thermal barrier problems for the high-power integrated electronic devices. However, designing polymer composites with high filler loads remains a challenge...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Carbon (New York) 2023-06, Vol.211, p.118096, Article 118096
Hauptverfasser: Li, Yi-Ke, Li, Wen-Jing, Wang, Zhi-Xing, Du, Pei-Yao, Xu, Ling, Jia, Li-Chuan, Yan, Ding-Xiang
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Polymer composites embedded with high filler loads (≥50 wt%) are urgently needed to address the electromagnetic interference (EMI) shielding and thermal barrier problems for the high-power integrated electronic devices. However, designing polymer composites with high filler loads remains a challenge due to difficulties in processability and poor flexibility. Herein, high graphene nanoplates-loaded polyurethane (GNP/PU) composites were enabled by a tractable and scalable polymer-infiltrated technique, in which GNPs were in compact contact face to face and arranged along the in-plane direction. The formation of such structure provided good channels for the transmission of electrons and phonons in the GNP/PU composites. Impressively, the GNP/PU composites showed strong EMI shielding and thermal conductivity, with a superior EMI shielding effectiveness of 67.6 dB (0.4 mm thickness), and extremely high thermal conductivity of 41.60 W/(m·K). Moreover, the GNP/PU composites were proven to have excellent mechanical flexibility, EMI shielding stability, and thermal management capability. With good comprehensive performance and high processability, the GNP/PU composites hold great promise for EMI shielding and thermal management applications in the field of highly integrated electronics. [Display omitted]
ISSN:0008-6223
1873-3891
DOI:10.1016/j.carbon.2023.118096