Unravelling the chemisorption mechanism of epoxy-amine coatings on Zr-based converted galvanized steel by combined static XPS/ToF-SIMS approach

[Display omitted] •Interfacial bonding investigation between DETA and HDG steel.•Effect of Zr-based conversion on the interfacial interactions by XPS/SIMS.•Influence of the Cu(II) additive on the chemisorption.•Preferential adsorption of DETA on the Zn atoms of converted substrates.•Proof of chemiso...

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Veröffentlicht in:Applied surface science 2022-10, Vol.599, p.153798, Article 153798
Hauptverfasser: Cristaudo, Vanina, Baert, Kitty, Laha, Priya, Lim, Mary Lyn, Steely, Lee, Brown-Tseng, Elizabeth, Terryn, Herman, Hauffman, Tom
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Sprache:eng
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Zusammenfassung:[Display omitted] •Interfacial bonding investigation between DETA and HDG steel.•Effect of Zr-based conversion on the interfacial interactions by XPS/SIMS.•Influence of the Cu(II) additive on the chemisorption.•Preferential adsorption of DETA on the Zn atoms of converted substrates.•Proof of chemisorption on the Cu cationic sites on converted substrates by SIMS. This work aims at the elucidation of the interfacial interactions established between an epoxy-amine coating and hot-dip galvanized (HDG) steel. The influence of the Zr-based conversion treatment of the substrate and the use of the Cu(II) additive on interfacial bonding is studied. To this purpose, an amine-functionalized molecule – diethylenetriamine (DETA) – is adsorbed. The complex multi-metal oxide surface of the Cu-modified Zr-based converted substrate is decomposed in derivative (simpler) systems. The resulting DETA-adsorbed model and multi-metal surfaces are investigated by X-ray photo-electron spectroscopy (XPS), and by examination of the N 1s peak, the interfacial bond density is determined. Time-of-flight secondary ion mass spectrometry (ToF-SIMS) is performed to discriminate between the different metal oxide contributions present on the substrate surface. Preferential adsorption of the DETA molecule on the zinc atoms is found on converted substrates. The interfacial bonding with the Cu cationic sites introduced by the copper additive is proven.
ISSN:0169-4332
1873-5584
DOI:10.1016/j.apsusc.2022.153798