Investigation of interfaces and threshold voltage instabilities in normally-off MOS-gated InGaN/AlGaN/GaN HEMTs

[Display omitted] •Normally-off devices prepared by polarization engineering using InGaN layer.•Polarization charge at the InGaN/AlGaN interface confirmed by XPS.•Peculiar threshold voltage shift during positive gate bias stress experiment.•Holes from 2DHG recombine with electrons in InGaN layer gen...

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Veröffentlicht in:Applied surface science 2020-10, Vol.528, p.146824, Article 146824
Hauptverfasser: Pohorelec, O., Ťapajna, M., Gregušová, D., Gucmann, F., Hasenöhrl, S., Haščík, Š., Stoklas, R., Seifertová, A., Pécz, B., Tóth, L., Kuzmík, J.
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Sprache:eng
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Zusammenfassung:[Display omitted] •Normally-off devices prepared by polarization engineering using InGaN layer.•Polarization charge at the InGaN/AlGaN interface confirmed by XPS.•Peculiar threshold voltage shift during positive gate bias stress experiment.•Holes from 2DHG recombine with electrons in InGaN layer generating photons. Polarization engineering is a promising approach to achieve high positive threshold voltage (Vth) in GaN-based metal-oxide-semiconductor high electron mobility transistors (MOS HEMTs). In this paper, we investigate all critical interfaces of polarization-engineered normally-off Al2O3/InGaN/AlGaN/GaN MOS HEMTs using transmission electron microscopy and X-ray photoelectron spectroscopy. Mechanisms of threshold voltage (VTH) instabilities are also analyzed. Devices were subjected to positive-bias stress-recovery experiments to capture the transient change in Vth. We propose a model that explains observed peculiar behavior and discuss the role of 2-dimensional hole gas (2DHG) in Al2O3/InGaN/AlGaN/GaN MOS HEMTs Vth shift.
ISSN:0169-4332
1873-5584
DOI:10.1016/j.apsusc.2020.146824