Investigation of cooling capability of ceramic substrates for power electronics applications

Investigation of cooling capability of ceramic substrates for power electronics applications

•Numerical study of cooling capability of Al2O3 and AlN substrates.•Effects of ceramic substrate thickness, material and flow rate were investigated.•Numerical study verified by experiments on real test configuration.•Al2O3 shows similar cooling capabilities to AlN for thickness 

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Veröffentlicht in:Applied thermal engineering 2024-06, Vol.247, p.123110, Article 123110
Hauptverfasser: Hlina, Jiri, Reboun, Jan, Janda, Martin
Format: Artikel
Sprache:eng
Schlagworte:
Alumina
Aluminum nitride
Ceramics
Cooling
Numerical study
Substrate
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Beschreibung
Zusammenfassung:•Numerical study of cooling capability of Al2O3 and AlN substrates.•Effects of ceramic substrate thickness, material and flow rate were investigated.•Numerical study verified by experiments on real test configuration.•Al2O3 shows similar cooling capabilities to AlN for thickness 
ISSN:1359-4311
DOI:10.1016/j.applthermaleng.2024.123110