Structural parameters study of porous medium heat exchanger for high-power chip cooling

•Cylinder- and cuboid-based skeleton porous medium heat exchangers are proposed.•Cylinder -based skeleton heat exchangers has better temperature control performance.•Optimal porous medium heat exchanger decreased maximum temperature by 19.62%.•Uniform distribution of temperature within the chips increased by 23.38%. Water cooling is an important technology for controlling the temperature of data centers. In this study evaluates the performance of newly designed cylinder-based and cuboid-based skeleton porous-medium heat exchangers for cooling a 80Wcm-2 high-power chip. The impact of the skeleton size, partial encryption, and porosity of the porous medium heat exchangers on the temperature control of the high-power chip was investigated using a non-isothermal multiphysics model self-contained in 6SigmaET. The results indicated that the skeleton size, encryption, and porosity of the porous medium heat exchangers significantly affected the average temperature, temperature distribution, maximum temperature difference, and pressure decrease within the chips. Porous medium heat exchangers with cylinder-based skeletons yielded higher performance rates than those with a cuboid-based skeleton with the same porosity. The partially encrypted cylinder-based skeleton porous medium heat exchanger with a porosity of 0.64 and a cylinder diameter of 0.5 mm exhibited the highest temperature control performance. In comparison with the conventional finned heat exchanger, the optimal porous medium heat exchanger decreased the maximum temperature by 19.62% and increased the uniform distribution of temperature by 23.38%.