From 2D to 3D electrochemical microfabrication of nickel architectures at room temperature: Synthesis and characterization of microstructure and mechanical properties

Recent development in direct electrochemical 3D microprinting allows the fabrication of 3D metallic micro-components of predominantly noble metals with the positive standard reduction potentials (e.g., Cu, Au, or Pt). These pure metals (e.g., Cu, Au, or Pt) have a small shear modulus up to 60 GPa, which limits one of the important strengthening mechanisms, Taylor hardening. Hence, their mechanical strength is relatively low and limits the application in a structural component. 3D printing of mechanically high-strength metals (e.g., Ni), specifically, printing of microscale parts by direct electrodeposition using a voxel-by-voxel printing technique, is so far very challenging due to the negative standard reduction potential, which leads to hydrogen evolution and unstable printing. In this paper, we demonstrate the stable and successful room temperature (RT) electrochemical printing of Ni micro-architectures by using a newly formulated Ni ink and supporting electrolyte, which were developed through 2D voltammetry and deposition analysis. The micro manufacturing of Ni succeeds at a high deposition speed up to ∼61 nm/s, which is the fastest speed reported so far for microprinting of Ni. 3D printed micropillars feature a heterogeneous nanostructure from ∼13 nm at the center to ∼27 nm at the perimeter. By performing micropillar compression tests, the printed pillars exhibit a high compressive yield-strength of 2.3 ± 0.1 GPa, only ∼15 % lower than 2D processed samples (2.7 ± 0.1 GPa) featuring a homogeneous nanostructure of 27 ± 16 nm. Thus, by deposition of stronger, but less noble metals we show a new pathway to enhance the mechanical robustness of 3D-printed structures, opening up new applications where mechanical rigidity is essential.