Application of response surface method for optimal transfer conditions of multi-layer ceramic capacitor alignment system

The multi-layer ceramic capacitor （MLCC） alignment system aims at the inter-process automation between the first and the second plastic processes. As a result of testing performance verification of MLCC alignment system, the average alignment rates are 95% for 3216 chip, 88.5% for 2012 chip and 90.8% for 3818 chip. The MLCC alignment system can be accepted for practical use because the average manual alignment is just 80%. In other words, the developed MLCC alignment system has been upgraded to a great extent, compared with manual alignment. Based on the successfully developed MLCC alignment system, the optimal transfer conditions have been explored by using RSM. The simulations using ADAMS has been performed according to the cube model of CCD. By using MiniTAB, the model of response surface has been established based on the simulation results. The optimal conditions resulted from the response optimization tool of MiniTAB has been verified by being assigned to the prototype of MLCC alignment system.