Development of Sn-Zn lead-free solders bearing alloying elements

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Bibliographische Detailangaben
Veröffentlicht in:	Journal of materials science. Materials in electronics 2010-01, Vol.21 (1), p.1-15
Hauptverfasser:	LIANG ZHANG, XUE, Song-Bai, GAO, Li-Li, ZHONG SHENG, HUAN YE, XIAO, Zheng-Xiang, GUANG ZENG, YAN CHEN, YU, Sheng-Lin
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Condensed matter: structure, mechanical and thermal properties Corrosion Corrosion prevention Exact sciences and technology Fatigue, brittleness, fracture, and cracks Fractures Joining, thermal cutting: metallurgical aspects Mechanical and acoustical properties of condensed matter Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Mechanical properties of solids Metals. Metallurgy Physics
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