Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

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Bibliographische Detailangaben
Veröffentlicht in:	Microsystem technologies 2007-07, Vol.13 (11-12), p.1567-1573
Hauptverfasser:	KOO, Ja-Myeong, JUNG, Seung-Boo
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Instruments, apparatus, components and techniques common to several branches of physics and astronomy Mechanical engineering. Machine design Mechanical instruments, equipment and techniques Microelectronic fabrication (materials and surfaces technology) Micromechanical devices and systems Physics Precision engineering, watch making Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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