Reduction of charge injection into PECVD SiNxHy by control of deposition chemistry
Gespeichert in:
| Veröffentlicht in: | Journal of electronic materials 1990, Vol.19 (1), p.19-27 |
|---|---|
| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 27 |
|---|---|
| container_issue | 1 |
| container_start_page | 19 |
| container_title | Journal of electronic materials |
| container_volume | 19 |
| creator | SMITH, D. L ALIMONDA, A. S CHAU-CHEN CHEN TUAN, H. C |
| description | |
| doi_str_mv | 10.1007/BF02655547 |
| format | Article |
| fullrecord | <record><control><sourceid>pascalfrancis_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1007_BF02655547</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>19802951</sourcerecordid><originalsourceid>FETCH-LOGICAL-c259t-eaaf180e9186d820d94ce3d7a5a1864dc4b7cd1326dd285211e842a4378b26383</originalsourceid><addsrcrecordid>eNpFkF1LwzAYhYMoWKc3_oLceCNU8-ajTS-1bk4YKvMD70qWpC6ja0ZSYf33blbY1YHDcw6Hg9AlkBsgJL-9nxCaCSF4foQSEJylILOvY5QQlkEqKBOn6CzGFSEgQEKC5nNrfnTnfIt9jfVShW-LXbuyg-fazuPXcfn5gN_c83ba40WPtW-74Jt9wNiNj-4P1Uu7drEL_Tk6qVUT7cW_jtDHZPxeTtPZy-NTeTdLNRVFl1qlapDEFruFRlJiCq4tM7kSaudwo_ki1wYYzYyhUlAAKzlVnOVyQTMm2QhdD706-BiDratNcGsV-gpItX-jOryxg68GeKOiVk0dVKtdPCQKSWghgP0CvZxeOA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Reduction of charge injection into PECVD SiNxHy by control of deposition chemistry</title><source>SpringerLink Journals - AutoHoldings</source><creator>SMITH, D. L ; ALIMONDA, A. S ; CHAU-CHEN CHEN ; TUAN, H. C</creator><creatorcontrib>SMITH, D. L ; ALIMONDA, A. S ; CHAU-CHEN CHEN ; TUAN, H. C</creatorcontrib><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/BF02655547</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>New York, NY: Institute of Electrical and Electronics Engineers</publisher><subject>Condensed matter: structure, mechanical and thermal properties ; Exact sciences and technology ; Physics ; Solid surfaces and solid-solid interfaces ; Surface and interface dynamics and vibrations ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Thin film structure and morphology</subject><ispartof>Journal of electronic materials, 1990, Vol.19 (1), p.19-27</ispartof><rights>1991 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c259t-eaaf180e9186d820d94ce3d7a5a1864dc4b7cd1326dd285211e842a4378b26383</citedby><cites>FETCH-LOGICAL-c259t-eaaf180e9186d820d94ce3d7a5a1864dc4b7cd1326dd285211e842a4378b26383</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,4023,27922,27923,27924</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=19802951$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>SMITH, D. L</creatorcontrib><creatorcontrib>ALIMONDA, A. S</creatorcontrib><creatorcontrib>CHAU-CHEN CHEN</creatorcontrib><creatorcontrib>TUAN, H. C</creatorcontrib><title>Reduction of charge injection into PECVD SiNxHy by control of deposition chemistry</title><title>Journal of electronic materials</title><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Exact sciences and technology</subject><subject>Physics</subject><subject>Solid surfaces and solid-solid interfaces</subject><subject>Surface and interface dynamics and vibrations</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>Thin film structure and morphology</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1990</creationdate><recordtype>article</recordtype><recordid>eNpFkF1LwzAYhYMoWKc3_oLceCNU8-ajTS-1bk4YKvMD70qWpC6ja0ZSYf33blbY1YHDcw6Hg9AlkBsgJL-9nxCaCSF4foQSEJylILOvY5QQlkEqKBOn6CzGFSEgQEKC5nNrfnTnfIt9jfVShW-LXbuyg-fazuPXcfn5gN_c83ba40WPtW-74Jt9wNiNj-4P1Uu7drEL_Tk6qVUT7cW_jtDHZPxeTtPZy-NTeTdLNRVFl1qlapDEFruFRlJiCq4tM7kSaudwo_ki1wYYzYyhUlAAKzlVnOVyQTMm2QhdD706-BiDratNcGsV-gpItX-jOryxg68GeKOiVk0dVKtdPCQKSWghgP0CvZxeOA</recordid><startdate>1990</startdate><enddate>1990</enddate><creator>SMITH, D. L</creator><creator>ALIMONDA, A. S</creator><creator>CHAU-CHEN CHEN</creator><creator>TUAN, H. C</creator><general>Institute of Electrical and Electronics Engineers</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>1990</creationdate><title>Reduction of charge injection into PECVD SiNxHy by control of deposition chemistry</title><author>SMITH, D. L ; ALIMONDA, A. S ; CHAU-CHEN CHEN ; TUAN, H. C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c259t-eaaf180e9186d820d94ce3d7a5a1864dc4b7cd1326dd285211e842a4378b26383</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1990</creationdate><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Exact sciences and technology</topic><topic>Physics</topic><topic>Solid surfaces and solid-solid interfaces</topic><topic>Surface and interface dynamics and vibrations</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>Thin film structure and morphology</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>SMITH, D. L</creatorcontrib><creatorcontrib>ALIMONDA, A. S</creatorcontrib><creatorcontrib>CHAU-CHEN CHEN</creatorcontrib><creatorcontrib>TUAN, H. C</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>SMITH, D. L</au><au>ALIMONDA, A. S</au><au>CHAU-CHEN CHEN</au><au>TUAN, H. C</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Reduction of charge injection into PECVD SiNxHy by control of deposition chemistry</atitle><jtitle>Journal of electronic materials</jtitle><date>1990</date><risdate>1990</risdate><volume>19</volume><issue>1</issue><spage>19</spage><epage>27</epage><pages>19-27</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><cop>New York, NY</cop><pub>Institute of Electrical and Electronics Engineers</pub><doi>10.1007/BF02655547</doi><tpages>9</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0361-5235 |
| ispartof | Journal of electronic materials, 1990, Vol.19 (1), p.19-27 |
| issn | 0361-5235 1543-186X |
| language | eng |
| recordid | cdi_crossref_primary_10_1007_BF02655547 |
| source | SpringerLink Journals - AutoHoldings |
| subjects | Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Physics Solid surfaces and solid-solid interfaces Surface and interface dynamics and vibrations Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film structure and morphology |
| title | Reduction of charge injection into PECVD SiNxHy by control of deposition chemistry |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T12%3A45%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Reduction%20of%20charge%20injection%20into%20PECVD%20SiNxHy%20by%20control%20of%20deposition%20chemistry&rft.jtitle=Journal%20of%20electronic%20materials&rft.au=SMITH,%20D.%20L&rft.date=1990&rft.volume=19&rft.issue=1&rft.spage=19&rft.epage=27&rft.pages=19-27&rft.issn=0361-5235&rft.eissn=1543-186X&rft.coden=JECMA5&rft_id=info:doi/10.1007/BF02655547&rft_dat=%3Cpascalfrancis_cross%3E19802951%3C/pascalfrancis_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |