The relationship between dielectric and rheological behavior of epoxy resin during cure
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| Veröffentlicht in: | Journal of polymer research 1994-04, Vol.1 (2), p.183-190 |
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| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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| container_end_page | 190 |
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| container_issue | 2 |
| container_start_page | 183 |
| container_title | Journal of polymer research |
| container_volume | 1 |
| creator | Chen, Jung-Yun Huang, Pieng-Tsung Lee, Sung-Nung |
| description | |
| doi_str_mv | 10.1007/BF01374093 |
| format | Article |
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| fulltext | fulltext |
| identifier | ISSN: 1022-9760 |
| ispartof | Journal of polymer research, 1994-04, Vol.1 (2), p.183-190 |
| issn | 1022-9760 1572-8935 |
| language | eng |
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| source | SpringerLink Journals - AutoHoldings |
| title | The relationship between dielectric and rheological behavior of epoxy resin during cure |
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