In Situ Reconnection of Nanoelectrodes Over 20 nm Gaps on Polyimide Substrate

Nanoelectrode In Situ Reconnection The current densities in electronic circuitry are approaching the electromigration threshold, which may result in the fracture of the circuits. Flexible electronic devices might also be prone to fracture problems. In article number 2300283, lke Scheer, Dong Xiang, and co‐workers present a technique to in‐situ reconnect the two electrodes; thus, healing the fractured circuit is reported by using the O2 plasma etched polyimide substrate to trap the migrating metal atoms.