Defect Engineering in A 2 B O 4 Thin Films via Surface‐Reconstructed LaSrAlO 4 Substrates
Ruddlesden–Popper oxides ( A 2 B O 4 ) have attracted significant attention regarding their potential application in novel electronic and energy devices. However, practical uses of A 2 B O 4 thin films have been limited by extended defects such as out‐of‐phase boundaries (OPBs). OPBs disrupt the lay...
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Veröffentlicht in: | Small methods 2022-11, Vol.6 (11) |
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Hauptverfasser: | , , , , , , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Ruddlesden–Popper oxides (
A
2
B
O
4
) have attracted significant attention regarding their potential application in novel electronic and energy devices. However, practical uses of
A
2
B
O
4
thin films have been limited by extended defects such as out‐of‐phase boundaries (OPBs). OPBs disrupt the layered structure of
A
2
B
O
4
, which restricts functionality. OPBs are ubiquitous in
A
2
B
O
4
thin films but inhomogeneous interfaces make them difficult to suppress. Here, OPBs in
A
2
B
O
4
thin films are suppressed using a novel method to control the substrate surface termination. To demonstrate the technique, epitaxial thin films of cuprate superconductor La
2‐
x
Sr
x
CuO
4
(
x
= 0.15) are grown on surface‐reconstructed LaSrAlO
4
substrates, which are terminated with self‐limited perovskite double layers. To date, La
2‐
x
Sr
x
CuO
4
thin films are grown on LaSrAlO
4
substrates with mixed‐termination and exhibit multiple interfacial structures resulting in many OPBs. In contrast, La
2‐
x
Sr
x
CuO
4
thin films grown on surface‐reconstructed LaSrAlO
4
substrates energetically favor only one interfacial structure, thus inhibiting OPB formation. OPB‐suppressed La
2‐
x
Sr
x
CuO
4
thin films exhibit significantly enhanced superconducting properties compared with OPB‐containing La
2‐
x
Sr
x
CuO
4
thin films. Defect engineering in
A
2
B
O
4
thin films will allow for the elimination of various types of defects in other complex oxides and facilitate next‐generation quantum device applications. |
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ISSN: | 2366-9608 2366-9608 |
DOI: | 10.1002/smtd.202200880 |