Mg Compensating Design in the Melting-Sintering Method For High-Performance Mg 3 (Bi, Sb) 2 Thermoelectric Devices

N-type Mg (Bi, Sb) -based thermoelectric (TE) alloys show great promise for solid-state power generation and refrigeration, owing to their excellent figure-of-merit (ZT) and using cheap Mg. However, their rigorous preparation conditions and poor thermal stability limit their large-scale applications...

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Veröffentlicht in:Small (Weinheim an der Bergstrasse, Germany) Germany), 2023-11, Vol.19 (44), p.e2303840
Hauptverfasser: Liu, Yali, Geng, Yang, Dou, Yubo, Wu, Xuelian, Hu, Lipeng, Liu, Fusheng, Ao, Weiqin, Zhang, Chaohua
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Sprache:eng
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Zusammenfassung:N-type Mg (Bi, Sb) -based thermoelectric (TE) alloys show great promise for solid-state power generation and refrigeration, owing to their excellent figure-of-merit (ZT) and using cheap Mg. However, their rigorous preparation conditions and poor thermal stability limit their large-scale applications. Here, this work develops an Mg compensating strategy to realize n-type Mg (Bi, Sb) by a facile melting-sintering approach. "2D roadmaps" of TE parameters versus sintering temperature and time are plotted to understand the Mg-vacancy-formation and Mg-diffusion mechanisms. Under this guidance, high weight mobility of 347 cm  V  s and power factor of 34 µW cm  K can be obtained for Mg Bi Te , and a peak ZT≈1.55 at 723 K and average ZT≈1.25 within 323-723 K can be obtained for Mg (Sb Bi ) Te . Moreover, this Mg compensating strategy can also improve the interfacial connecting and thermal stability of corresponding Mg (Bi, Sb) /Fe TE legs. As a consequence, this work fabricates an 8-pair Mg Sb -GeTe-based power-generation device reaching an energy conversion efficiency of ≈5.0% at a temperature difference of 439 K, and a one-pair Mg Sb -Bi Te -based cooling device reaching -10.7 °C at the cold side. This work paves a facile way to obtain Mg Sb -based TE devices at low cost and also provides a guide to optimize the off-stoichiometric defects in other TE materials.
ISSN:1613-6810
1613-6829
DOI:10.1002/smll.202303840