Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems (Small 4/2022)

Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems (Small 4/2022)

Stress Engineering In article number 2105748, Hoang‐Phuong Phan and co‐workers summarize state‐of‐the‐art technologies in stress engineering for the development of innovative 3D micro‐ and nano‐architectures. A broad range of applications including sensors, optical systems, bioelectronics interfaces...

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Veröffentlicht in:Small (Weinheim an der Bergstrasse, Germany) Germany), 2022-01, Vol.18 (4), p.n/a
Hauptverfasser: Truong, Thanh‐An, Nguyen, Tuan‐Khoa, Zhao, Hangbo, Nguyen, Nhat‐Khuong, Dinh, Toan, Park, Yoonseok, Nguyen, Thanh, Yamauchi, Yusuke, Nguyen, Nam‐Trung, Phan, Hoang‐Phuong
Format: Artikel
Sprache:eng
Schlagworte:
flexible electronics
micro‐/nano‐3D structures
stress, thin films
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Zusammenfassung:Stress Engineering In article number 2105748, Hoang‐Phuong Phan and co‐workers summarize state‐of‐the‐art technologies in stress engineering for the development of innovative 3D micro‐ and nano‐architectures. A broad range of applications including sensors, optical systems, bioelectronics interfaces, micro robots, and implantable and wearable devices are highlighted.
ISSN:1613-6810
1613-6829
DOI:10.1002/smll.202270019