89‐2: Late‐News Paper: Strength Optimized Laser Cutting of High Refractive Index Wafers for Augmented Reality

As the industrialization of waveguide based AR devices is progressing, considerations around design based shaping of waveguides as well as robustness move into focus. A promising approach for scalable free‐form cutting with high strength and precision is the utilization of ultrashort pulsed lasers. Various possible laser process parameters and different material compositions of high index glasses are challenging the optimization with respect to strength of the glass. SCHOTT AG and 3D‐Micromac AG optimized a separation process towards high and predictable bending strength and integrated it into a modular machine concept freely scalable from lab to mass production use.